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phone mainboard pcb
Material:FR-4
Layers:6 layers(1+4+1)
Thickness:1.0mm
Surface Finish : Immersion Gold +OSP
Copper thickness for outer layers:1OZ
Min. trace width/Min. trace space:3mil/3mil
Min.Drilling holes size:0.2MM
A plurality of single ended to differential impedance control
Immediately consult
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