| The number of layers | 0-108 Layer | Plate type | FR-4 material, high-speed material, high-speed material, metal substrate material |
| Finished product dimensions | ≤24inch*48inch | Material branding | Lianmao, Shengyi, Taiyao, South Asia, Panasonic, Isola, Nelco, Rogers, Taconic, Arlon, etc |
| Plate thickness range | 0.2mm-8.0mm | Plate thickness tolerance | Tolerance: ±0.1 mm (plate thickness≤ 1.0 mm), ± 10% (plate thickness> 1.0 mm); Special tolerances: Plate thickness±0.1 mm (≤ 2.0 mm), ± 0.15 mm (2.1-3.0 mm) |
| Surface treatment | Electroplated copper-nickel gold, immersed gold, hard gold plated (with/without nickel), gold-plated fingers, lead-free tin-spraying, OSP, chemical nickel-palladium gold, soft-gold plated (with/without nickel), immersed silver, immersed tin, ENIG+OSP, ENIG+G/F, full plate gold plating +G/F, immersed silver +G/F, immersed tin +G/F, leaded tin | ||
| Minimum aperture size | 4MIL | The inner layer is thick with copper | 0.5 OZ-6 OZ |
| Laser aperture diameter | 4mil-6mil | Aperture tolerance (through-hole plating) | ±2MIL |
| The outer layer of copper is thick | 0.33OZ-6OZ | Aperture tolerance (non-plated through-hole) | ±2MIL |
| Line width/spacing (minimum) | 3/3mil | Minimum window opening for weld protection | 1mil |
| Characteristic impedance accuracy | Conventional tolerances: ±3Ω (<30Ω), ±10% (≥30Ω); Special tolerances: ±3Ω (<30Ω), ±5% (≥60Ω), ±7% (≥45Ω) | Solder mask alignment tolerance | ±2MIL |
| Weld-resistant bridge width | ≥3MIL | Solder mask hardness | ≥6H |
| Solder mask color | Green, green matte, blue, blue matte, black, black matte, yellow, red, white | ||
| Outline tolerance | ±0.1mm | Plate koji | 0.75% max. |
| Flame retardancy | 94-in-0 | ||
| The number of layers | 1-8 Layer | Maximum panel size | 19.6*31.0 inch |
| Maximum finished product size | 9inch*14inch(Extreme 9inch*23inch) | Minimum panel size | 9.0*12.0 inch |
| Dimensional tolerances for the finished product | ±0.1mm | Maximum adult plate thickness | 0.80mm |
| Minimum finished plate thickness | 0.05mm | ||
| Minimum line width - inner layer | 3MIL | Minimum spacing - outer layer | 3.5mil |
| Minimum line width - outer layer | 3MIL | The inner layer is thick with copper | ≤2OZ |
| Minimum spacing - inner layer | 3MIL | The outer layer of copper is thick | ≤3OZ |
| Minimum drilled hole diameter | 0.15mm | The minimum distance from the hole edge to the plate edge | 8MIL |
| Maximum aperture size | 6.4mm | Minimum hole ring size | 4mil (partial 3.2mil) |
| Aperture tolerances | ±2MIL | Minimal BGA pad design | ≥ 8mil (Limit 7mil) |
| The distance from the hole edge to the hole edge | 10MIL | Minimal SMT design | ≥7MIL |
| Weld-resistant bridge width | ≥4MIL | The minimum width of the text | 4MIL |
| Minimum window opening for weld protection | 3mil (partial 2.5mil) | Character minimum altitude | 23MIL |
| The minimum distance from the anti-solder window to the other periphery | 3MIL | ||
| There are lead sprayed tin, immersed gold, chemical nickel palladium gold, soft gold plating, hard gold plating, immersed silver, OSP, immersed tin, ENIG + OSP, ENIG + G / F |
| Whether it has the ability to test impedance | Yes | |||
| Rigid flex joint structure | 1st Stage HDI, 2nd Stage HDI; Flying tail type rigid flex plate (≤ 20 layers) | Plate type | Raw Material |
| Flexible substrate | SF305, RF-775, DuPont AP | Rigid substrate | IT-180A、S1000-2、 TU-768(TU-752)、 85N、RO4350B、VT-901、R-5775、TU-872SLK、TU-862HF |
| Reinforce | PI | Covering film | SF305C series, FHK series, FR series |
| Rigid area | Green, red, blue, black, white | Flexible area | Green, red, blue, black, white |
| Rigid area | 2-20 floors | Flexible area | 1-8 Layer |
| Rigid area | 0.3mm-4.0mm | Flexible area | 0.05mm-0.80mm |
| Maximum finished product size | 16inch*29inch | Minimum finished product size | 10mm*15mm |
| Rigid area | ±4MIL | Flexible area | ±4MIL |
| The inner layer is thick with copper | ≤2OZ | The outer layer of copper is thick | ≤3OZ |
| Hole edge to step edge | 0.5mm | ||
| Rigid area | 12:01 | ||
| Inner flex core plate | 0.5mil | Inner hard plate core | 0.05mm |
| Semi-cured wafer specifications | 106、1080 | ||
| Lead-free | Lead-free tin spraying, immersed gold, chemical nickel palladium, electroplated copper-nickel gold, soft-gold plating, hard gold-plated, immersed silver, OSP, immersed tin, ENIG+OSP, ENIG+G/F, full plate gold plating +G/F | There is lead | There is lead spraying tin |
| Electromagnetic shielding | SF-PC6000 | Impedance control | Typical Tolerances: Single-ended: ±5Ω (≤50Ω), ±10% (>50Ω) Differential: ±5Ω (≤50Ω), ±10% (>50Ω) Special Tolerances: Single-ended: ±3Ω (≤50Ω), ±8% (>50Ω) Differential:±4Ω (≤50Ω), ±8% (>50Ω) |