RELIABLE ACCURACY Advanced Capabilities
PCB assembly capabilities include Surface Mount Technology (SMT), Thru-hole, and mixed technology (SMT with Thru-hole) for single and double-sided placement. We support Fine Pitch components as small as 15 mil pitch, Passive Components as small as 0201 package, Ball Grid Arrays (BGA) as small as .4mm pitch with X-Ray inspected placements, and more