![MUL-ELE PCB](/img/logo.png)
SMT and Through-Hole Assembly | Fine Pitch Component Insertion |
Lead free Assembly | BGA and QFN Assembly |
One-stop PCB Assembly | BGA X-Ray Inspection |
Prototype PCB Assembly | Automated Optical Inspection |
PCB Assembly in low volumes | PCB testing for functionality |
AOI Testing Checks for solder paste Checks for components down to 0201" Checks for missing components, offset, incorrect parts, polarity X-Ray Inspection X-Ray provides high-resolution inspection | In-Circuit Testing In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems. Power-up Test Advanced Function Test Flash Device Programming Functional testing |
Selective Wave Soldering | Conformal Coating |
Complete box build | Kitting and 3D printing |
Inspection Methods | |
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AOI Testing | Checks for solder paste |
Checks for components down to 0201" | Checks for missing components, offset, incorrect parts, polarity |
X-Ray Inspection | X-Ray provides high-resolution inspection of: |
BGAs | Micro BGAs |
Micro BGAs | Bare boards |
In-Circuit Testing * In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems. | |
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Power-up Test | Advanced Function Test |
Flash Device Programming | Functional testing |