PCB Assembly

PCB Assembly
mul-ele provides PCBA assembly, low to medium MASS production volume. Our professional SMT factory has advanced equipment, such as the world-class stencil printing, SMT chip pick & place, solder reflow, and in-line testing and steel mesh manufacturing. AOI test machine and X-ray testing machines for quality check.

mul-ele PCB Assembly

mul-ele offers turn-key PCB assembly services OEM in prototype quantities or low-volume to mid-volume production runs. We handle the whole process including: ordering all the components, PCB manufacturing, PCB assembly, testing and final shipment. We are capable of assembling BGA, Micro-BGA, QFN and other leadless package parts.
SMT and Through-Hole AssemblyFine Pitch Component Insertion
Lead free AssemblyBGA and QFN Assembly
One-stop PCB AssemblyBGA X-Ray Inspection
Prototype PCB AssemblyAutomated Optical Inspection
PCB Assembly in low volumesPCB testing for functionality
AOI Testing                  Checks for solder paste                    Checks for components down to 0201"                    Checks for missing components, offset, incorrect parts, polarity                  X-Ray Inspection                  X-Ray provides high-resolution inspectionIn-Circuit Testing                  In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.                    Power-up Test                  Advanced Function Test                  Flash Device Programming                  Functional testing
Selective Wave SolderingConformal Coating
Complete box buildKitting and 3D printing
Surface Mount Technology
mul-ele all products follow IPC2 standards.With 18 years experience of placing BGA, UBGA, CSP and small profile passives down to and including 0201, mul-ele offers a cost effective high yield solution to any SMT requirement.
Pin Through Hole
Capabilities to place tape and reeled radial components sizes. Maximum PCB size is 40" x 40". Placement rates reach 15000 pieces per hour with an accuracy of 99% minimizing component loss.
RoHS Regulations
mul-ele have 2 kinds of solutions. Leadfree and leaded soldering process.            Each solutions room are divided into 2 seperated places. so there is no mix up.
Selective Wave Solder
Having the Selective Wave soldering machines, mul-ele achieves consistent quality and process control when assembling boards having multiple ground and power planes, high-current connectors or A-typical distribution of components. All AOI tested before QC.IPQC.
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non conductive dielectric layer that is applied onto the printed circuit board assembly to protect the electronic assembly from damage due to contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments. When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts, plastics, casings and print & packaging material
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts, plastics, casings and print & packaging material
Inspection Methods
AOI TestingChecks for solder paste
Checks for components down to 0201"Checks for missing components, offset, incorrect parts, polarity
X-Ray InspectionX-Ray provides high-resolution inspection of:
BGAsMicro BGAs
Micro BGAsBare boards
In-Circuit Testing
               * In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.
Power-up TestAdvanced Function Test
Flash Device ProgrammingFunctional testing

PCB Assembly

Contact Us